SIC
close
Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance Board Material
23-0513-11H Aries Electronics 23-0513-11H 6.4641
RFQ
ECAD 9226 0.00000000 Aries Electronics 0513 Bulk Active - Through Hole SIP - 23-0513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 23 (1 x 23) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
0500-1.300 Aries Electronics 0500-1.300 -
RFQ
ECAD 2363 0.00000000 Aries Electronics - - Active - - - - 0500-1 - download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - - - - - - - - - - - -
40-6508-21 Aries Electronics 40-6508-21 40.2018
RFQ
ECAD 6326 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 40-650 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Brass 0.500" (12.70mm) -
1109681-648 Aries Electronics 1109681-648 -
RFQ
ECAD 8009 0.00000000 Aries Electronics - Bulk Active - Through Hole DIP, 0.6" (15.24mm) Row Spacing Spacer 1109681 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 48 (2 x 24) Brass 0.100" (2.54mm) Brass 0.125" (3.18mm) -
18-6501-21 Aries Electronics 18-6501-21 11.0898
RFQ
ECAD 4213 0.00000000 Aries Electronics 501 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 18-650 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 20 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 18 (2 x 9) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.410" (10.41mm) -
18-3508-21 Aries Electronics 18-3508-21 18.4074
RFQ
ECAD 6325 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 18-3508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass 0.500" (12.70mm) -
38-81000-610C Aries Electronics 38-81000-610C 19.9781
RFQ
ECAD 2861 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame, Elevated 38-8100 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 38 (2 x 19) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
44-3574-11 Aries Electronics 44-3574-11 32.6262
RFQ
ECAD 4620 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 44-3574 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
06-0508-20 Aries Electronics 06-0508-20 2.3432
RFQ
ECAD 3064 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 105°C Through Hole SIP - 06-0508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 6 (1 x 6) Beryllium Copper - Brass 0.360" (9.14mm) -
40-6551-16 Aries Electronics 40-6551-16 68.9886
RFQ
ECAD 4187 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 40-6551 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
64-9518-10 Aries Electronics 64-9518-10 7.2730
RFQ
ECAD 4493 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.9" (22.86mm) Row Spacing Open Frame 64-9518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 64 (2 x 32) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
14-35W000-11-RC Aries Electronics 14-35W000-11-RC -
RFQ
ECAD 2907 0.00000000 Aries Electronics Correct-A-Chip® 35W000 Bulk Active - Through Hole - 14-35W0 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 27 - - 0.050" (1.27mm) - - Gold 10.0µin (0.25µm) SOIC-W DIP, 0.3" (7.62mm) Row Spacing 14 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
39-0501-30 Aries Electronics 39-0501-30 16.1872
RFQ
ECAD 6933 0.00000000 Aries Electronics 501 Bulk Active -55°C ~ 105°C Through Hole SIP - 39-0501 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 39 (1 x 39) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.690" (17.52mm) -
18-3518-10 Aries Electronics 18-3518-10 1.9900
RFQ
ECAD 631 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 18-3518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 21 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
18-6823-90C Aries Electronics 18-6823-90C 10.3262
RFQ
ECAD 3303 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active -55°C ~ 105°C Through Hole, Right Angle, Horizontal DIP, 0.6" (15.24mm) Row Spacing Closed Frame 18-6823 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
24-526-10 Aries Electronics 24-526-10 11.6900
RFQ
ECAD 36 0.00000000 Aries Electronics Lo-PRO®file, 526 Bulk Active -55°C ~ 105°C Through Hole DIP, ZIF (ZIP) Closed Frame 24-526 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 17 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 10.0µin (0.25µm) Tin 10.0µin (0.25µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.105" (2.67mm) -
16-3518-112 Aries Electronics 16-3518-112 5.7762
RFQ
ECAD 9451 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 16-3518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
20-0503-21 Aries Electronics 20-0503-21 13.5200
RFQ
ECAD 7007 0.00000000 Aries Electronics 0503 Bulk Active - Through Hole SIP - 20-0503 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA), Nylon, Glass Filled UL94 HB 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 20 (1 x 20) Beryllium Copper 0.100" (2.54mm) Brass 0.360" (9.14mm) -
40-6501-21 Aries Electronics 40-6501-21 16.3282
RFQ
ECAD 6624 0.00000000 Aries Electronics 501 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 40-650 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 9 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 40 (2 x 20) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.410" (10.41mm) -
36-3575-10 Aries Electronics 36-3575-10 16.1088
RFQ
ECAD 7365 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 36-3575 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 36 (2 x 18) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
60-9513-10T Aries Electronics 60-9513-10T 9.1728
RFQ
ECAD 4141 0.00000000 Aries Electronics Lo-PRO®file, 513 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.9" (22.86mm) Row Spacing Closed Frame 60-9513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 60 (2 x 30) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
01-0513-11 Aries Electronics 01-0513-11 0.3000
RFQ
ECAD 7521 0.00000000 Aries Electronics 0513 Bulk Active - Through Hole SIP - 01-0513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 - Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 1 (1 x 1) Beryllium Copper - Brass 0.125" (3.18mm) -
30-6511-10 Aries Electronics 30-6511-10 4.4238
RFQ
ECAD 2173 0.00000000 Aries Electronics 511 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 30-6511 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 30 (2 x 15) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
08-3508-21 Aries Electronics 08-3508-21 9.5375
RFQ
ECAD 5919 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 08-3508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Brass 0.360" (9.14mm) -
18-8750-610C Aries Electronics 18-8750-610C 11.6535
RFQ
ECAD 6251 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame, Elevated 18-8750 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
40-1508-21 Aries Electronics 40-1508-21 25.6881
RFQ
ECAD 4866 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.2" (5.08mm) Row Spacing Closed Frame 40-1508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Brass 0.360" (9.14mm) -
40-C182-00 Aries Electronics 40-C182-00 14.9137
RFQ
ECAD 2714 0.00000000 Aries Electronics EJECT-A-DIP™ Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 40-C182 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Brass 0.040" (1.02mm) -
56-PLS15057-12 Aries Electronics 56-PLS15057-12 78.5350
RFQ
ECAD 1721 0.00000000 Aries Electronics PLS Bulk Active -65°C ~ 125°C Through Hole PGA, ZIF (ZIP) Closed Frame 56-PLS1 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
15-0518-11 Aries Electronics 15-0518-11 1.8382
RFQ
ECAD 7556 0.00000000 Aries Electronics 518 Bulk Active - Through Hole SIP Open Frame 15-0518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 15 (1 x 15) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
28-6511-10 Aries Electronics 28-6511-10 4.3026
RFQ
ECAD 1530 0.00000000 Aries Electronics 511 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 28-6511 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 15 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 28 (2 x 14) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse