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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Color Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Connector Type Pitch Number of Rows Row Spacing Contact Finish Contact Finish Thickness Current Rating (Amps) Housing Material Material Flammability Rating Contact Type Pitch - Mating Number of Positions Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance Board Material
08-665000-00 Aries Electronics 08-665000-00 16.7954
RFQ
ECAD 3246 0.00000000 Aries Electronics Correct-A-Chip® 665000 Bulk Active - Surface Mount - 08-6650 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) SOIC-W SOIC 8 - 0.050" (1.27mm) Brass 0.031" (0.80mm) FR4 Epoxy Glass
68-PLS11033-16 Aries Electronics 68-PLS11033-16 -
RFQ
ECAD 8080 0.00000000 Aries Electronics PLS Bulk Obsolete -65°C ~ 200°C Through Hole PGA, ZIF (ZIP) Closed Frame Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Nickel Bronze 50.0µin (1.27µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
06-6513-11H Aries Electronics 06-6513-11H 2.6866
RFQ
ECAD 4014 0.00000000 Aries Electronics Lo-PRO®file, 513 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 06-6513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 6 (2 x 3) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
03-7360-10 Aries Electronics 03-7360-10 7.5417
RFQ
ECAD 7164 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 03-7360 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 3 (1 x 3) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
26-0518-11 Aries Electronics 26-0518-11 3.5148
RFQ
ECAD 5436 0.00000000 Aries Electronics 518 Bulk Active - Through Hole SIP Open Frame 26-0518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 26 (1 x 26) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
19-0513-10H Aries Electronics 19-0513-10H 3.4542
RFQ
ECAD 8624 0.00000000 Aries Electronics 0513 Bulk Active - Through Hole SIP - 19-0513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 19 (1 x 19) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
32-6571-16 Aries Electronics 32-6571-16 40.1775
RFQ
ECAD 6781 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 32-6571 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Nickel 0.100" (2.54mm) Beryllium Nickel 0.110" (2.78mm) -
05-7500-10 Aries Electronics 05-7500-10 8.0407
RFQ
ECAD 1992 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 05-7500 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 5 (1 x 5) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
30-3513-11H Aries Electronics 30-3513-11H 13.6917
RFQ
ECAD 3056 0.00000000 Aries Electronics Lo-PRO®file, 513 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame 30-3513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 30 (2 x 15) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
24-3570-11 Aries Electronics 24-3570-11 20.3546
RFQ
ECAD 2958 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 24-3570 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 11 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
08-0517-90C Aries Electronics 08-0517-90C 2.7876
RFQ
ECAD 5573 0.00000000 Aries Electronics 0517 Bulk Active - Through Hole, Right Angle SIP - 08-0517 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 - Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 8 (1 x 8) Beryllium Copper - Brass 0.125" (3.18mm) -
35-7XXXX-10 Aries Electronics 35-7XXXX-10 -
RFQ
ECAD 8739 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 35-7XXX Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 35 (1 x 35) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
32-6572-11 Aries Electronics 32-6572-11 24.6905
RFQ
ECAD 5220 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 32-6572 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
14-3518-00 Aries Electronics 14-3518-00 1.7847
RFQ
ECAD 3521 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 14-3518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
24-650000-10-P Aries Electronics 24-650000-10-P -
RFQ
ECAD 4087 0.00000000 Aries Electronics Correct-A-Chip® 650000 Bulk Discontinued at SIC - Through Hole - 24-650 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 98 - - 0.050" (1.27mm) - - Tin-Lead - SOIC DIP, 0.6" (15.24mm) Row Spacing 24 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
42-6554-16 Aries Electronics 42-6554-16 75.3414
RFQ
ECAD 5449 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 42-6554 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 42 (2 x 21) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
07-0600-10 Aries Electronics 07-0600-10 0.8838
RFQ
ECAD 6888 0.00000000 Aries Electronics 0600 Bulk Active Through Hole - 07-0600 Black Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 DIP, DIL - Header 0.100" (2.54mm) 1 - Tin 200.0µin (5.08µm) Forked 7
20-7905-10 Aries Electronics 20-7905-10 11.5988
RFQ
ECAD 7096 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 20-7905 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 20 (1 x 20) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
40-6518-10M Aries Electronics 40-6518-10M 8.6355
RFQ
ECAD 3623 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 40-6518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 12 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
18-3508-20 Aries Electronics 18-3508-20 9.3627
RFQ
ECAD 8587 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 18-3508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass 0.360" (9.14mm) -
02-1518-11H Aries Electronics 02-1518-11H 0.5479
RFQ
ECAD 3075 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.2" (5.08mm) Row Spacing Open Frame 02-1518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 2 (1 x 2) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
97-80C251 Aries Electronics 97-80C251 -
RFQ
ECAD 3270 0.00000000 Aries Electronics - Bulk Active - - - 97-80C2 - - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - - - - - - - - - - - - -
20-350001-10 Aries Electronics 20-350001-10 10.8535
RFQ
ECAD 6537 0.00000000 Aries Electronics Correct-A-Chip® 350000 Bulk Active - Through Hole - 20-3500 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected A325 EAR99 8536.69.4040 19 - - 0.050" (1.27mm) - - Tin 200.0µin (5.08µm) SOJ DIP, 0.3" (7.62mm) Row Spacing 20 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
48-6552-18 Aries Electronics 48-6552-18 169.3817
RFQ
ECAD 2263 0.00000000 Aries Electronics 55 Bulk Active -55°C ~ 250°C Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 48-6552 Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 6 1 A Polyetheretherketone (PEEK), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 48 (2 x 24) Beryllium Nickel 0.100" (2.54mm) Beryllium Nickel 0.110" (2.78mm) -
22-0518-00 Aries Electronics 22-0518-00 4.2218
RFQ
ECAD 9976 0.00000000 Aries Electronics 518 Bulk Active - Surface Mount SIP Open Frame 22-0518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 22 (1 x 22) Beryllium Copper 0.100" (2.54mm) Brass 0.046" (1.17mm) -
21-0508-21 Aries Electronics 21-0508-21 14.4432
RFQ
ECAD 3226 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 125°C Through Hole SIP - 21-0508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 21 (1 x 21) Beryllium Copper - Brass 0.360" (9.14mm) -
20-8375-310C Aries Electronics 20-8375-310C 12.7829
RFQ
ECAD 4613 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 20-8375 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
44-653000-10 Aries Electronics 44-653000-10 135.7450
RFQ
ECAD 4728 0.00000000 Aries Electronics Correct-A-Chip® 653000 Bulk Active - Through Hole Socket Included 44-6530 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A - UL94 V-0 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) PLCC DIP, 0.6" (15.24mm) Row Spacing 44 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
20-4508-30 Aries Electronics 20-4508-30 10.6535
RFQ
ECAD 7303 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Open Frame 20-4508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Brass 0.500" (12.70mm) -
10-9503-30 Aries Electronics 10-9503-30 8.2134
RFQ
ECAD 2692 0.00000000 Aries Electronics 503 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.9" (22.86mm) Row Spacing Closed Frame 10-9503 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 10 (2 x 5) Beryllium Copper 0.100" (2.54mm) Phosphor Bronze 0.500" (12.70mm) -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse