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Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Mounting Type | Package / Case | Type | Features | Base Product Number | Input Type | Current - Supply | Voltage - Input | Number of Channels | Voltage - Input (Max) | Output Type | Input | Output | Number of Circuits | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Logic Type | Number of Elements | Number of Bits per Element | Current - Output High, Low | Function | Voltage - Supply, Single/Dual (±) | Current - Quiescent (Max) | Slew Rate | Number of Inputs | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Protocol | Number of Drivers/Receivers | Duplex | Receiver Hysteresis | Data Rate | Interface | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Interrupt Output | Current - Output Source/Sink | Clock Frequency | Data Rate (Max) | Delay Time | Signal Conditioning | Number of Outputs | Clock Rate | Non-Volatile Memory | On-Chip RAM | Voltage - Core | Voltage Supply Source | Trigger Type | Max Propagation Delay @ V, Max CL | Current - Quiescent (Iq) | Current - Supply (Max) | Input Capacitance | Input Logic Level - Low | Input Logic Level - High | Circuit | Independent Circuits | Control Features | Output Configuration | Current - Output | Voltage - Output | Voltage - Output (Min/Fixed) | Voltage - Output (Max) | Number of Regulators | Voltage Dropout (Max) | PSRR | Protection Features |
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PCAL6416AEX1Z | 1.7200 | ![]() |
6 | 0.00000000 | NXP USA Inc. | Agile | Tape & Reel (TR) | Active | -40°C ~ 85°C | Surface Mount | 24-XFLGA | POR | PCAL6416 | Open Drain, Push-Pull | 1.65V ~ 5.5V | 24-X2QFN (2x2) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 5,000 | 16 | I²C, SMBus | Yes | 10mA, 25mA | 400 kHz | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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74LVC74ADB,112 | 0.2000 | ![]() |
6 | 0.00000000 | NXP USA Inc. | 74LVC | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 14-SSOP (0.209", 5.30mm Width) | D-Type | 74LVC74 | Complementary | 1.2V ~ 3.6V | 14-SSOP | download | Not applicable | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 1 | 2 | 1 | 24mA, 24mA | Set(Preset) and Reset | 250 MHz | Positive Edge | 5.2ns @ 3.3V, 50pF | 10 µA | 4 pF | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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M83261G13,557 | - | ![]() |
4292 | 0.00000000 | NXP USA Inc. | * | Tray | Active | - | Not applicable | 3 (168 Hours) | Vendor Undefined | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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TEA1752LT/N1/S1518 | 0.9400 | ![]() |
5 | 0.00000000 | NXP USA Inc. | * | Bulk | Active | TEA1752 | download | Not applicable | 3 (168 Hours) | Vendor Undefined | EAR99 | 8542.39.0001 | 2,500 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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LD6816CX4/30P,315 | - | ![]() |
5322 | 0.00000000 | NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 85°C | Surface Mount | 4-XFBGA, WLCSP | LD681 | 5.5V | Fixed | 4-WLCSP (0.76x0.76) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 9,000 | 100 µA | 250 µA | Enable | Positive | 150mA | 3V | - | 1 | 0.075V @ 150mA | 55dB (1kHz) | Over Current, Over Temperature, Transient Voltage | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MCZ33904B5EKR2 | - | ![]() |
9819 | 0.00000000 | NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | System Basis Chip | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | MCZ33 | 5.5V ~ 28V | 32-SOIC-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 1,000 | CAN | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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BGY587,112 | - | ![]() |
6599 | 0.00000000 | NXP USA Inc. | - | Bulk | Obsolete | CATV | Chassis Mount | SOT-115J | BGY58 | 220 mA | Push-Pull | 1 | SOT115J | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.33.0001 | 25 | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MC33FS6502CAE | 10.3100 | ![]() |
6027 | 0.00000000 | NXP USA Inc. | - | Tray | Active | -40°C ~ 125°C | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC33FS6502 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 250 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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74LVC1G126GW/S400125 | - | ![]() |
3243 | 0.00000000 | NXP USA Inc. | * | Bulk | Active | 74LVC1G126 | download | Not applicable | 3 (168 Hours) | Vendor Undefined | EAR99 | 8542.39.0001 | 3,000 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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S9S08SC4E0MTGR | 2.0483 | ![]() |
3412 | 0.00000000 | NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | S9S08 | 16-TSSOP | - | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935310062534 | 3A991A2 | 8542.31.0001 | 5,000 | 12 | S08 | 8-Bit | 40MHz | LINbus, SCI | LVD, POR, PWM, WDT | 4KB (4K x 8) | FLASH | - | 256 x 8 | 4.5V ~ 5.5V | A/D 8x10b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MCIMX6S1AVM08ADR | 31.7957 | ![]() |
2624 | 0.00000000 | NXP USA Inc. | i.MX6S | Tape & Reel (TR) | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935358563518 | 5A002A1 | 8542.31.0001 | 500 | ARM® Cortex®-A9 | 800MHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MMPF0100F9ANES | 10.4400 | ![]() |
1577 | 0.00000000 | NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | Converter, i.MX6 | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MMPF0100 | 2.8V ~ 4.5V | 56-QFN-EP (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 260 | 12 | Multiple | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
MCF51QE32CLH | 12.1300 | ![]() |
800 | 0.00000000 | NXP USA Inc. | MCF51QE | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | MCF51 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 800 | 54 | Coldfire V1 | 32-Bit Single-Core | 50MHz | I²C, SCI, SPI | LVD, PWM, WDT | 32KB (32K x 8) | FLASH | - | 8K x 8 | 1.8V ~ 3.6V | A/D 20x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MC13892CJVK | 12.0000 | ![]() |
1 | 0.00000000 | NXP USA Inc. | - | Tray | Active | -40°C ~ 85°C | Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply | Surface Mount | 139-TFBGA | MC13892 | - | - | 139-PBGA (7x7) | - | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 2,080 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MC9S12E128CPVE | 31.0600 | ![]() |
6981 | 0.00000000 | NXP USA Inc. | HCS12 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 112-LQFP | MC9S12 | 112-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318239557 | EAR99 | 8542.31.0001 | 300 | 91 | HCS12 | 16-Bit | 25MHz | EBI/EMI, I²C, SCI, SPI | POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 8K x 8 | 2.35V ~ 2.75V | A/D 16x10b; D/A 2x8b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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CBT3306D,112 | - | ![]() |
7095 | 0.00000000 | NXP USA Inc. | 74CBT | Tube | Active | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | Bus Switch | CBT3306 | 4.5V ~ 5.5V | 8-SO | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 1 | - | Single Supply | 1 x 1:1 | 2 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MCIMX6S7CVM08AD | 35.0672 | ![]() |
1610 | 0.00000000 | NXP USA Inc. | i.MX6S | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | - | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935354192557 | OBSOLETE | 0000.00.0000 | 60 | ARM® Cortex®-A9 | 800MHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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74AXP1G02GMH | 0.0800 | ![]() |
175 | 0.00000000 | NXP USA Inc. | 74AXP | Bulk | Active | -40°C ~ 85°C | Surface Mount | 6-XFDFN | - | 74AXP1G02 | 1 | 0.7V ~ 2.75V | 6-XSON (1.45x1) | download | EAR99 | 8542.39.0001 | 1 | NOR Gate | 8mA, 8mA | 600 nA | 2 | 2.8ns @ 2.5V, 5pF | 0.7V | 1.6V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MCF5275CVM166J | - | ![]() |
6029 | 0.00000000 | NXP USA Inc. | MCF527x | Tray | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 256-LBGA | MCF5275 | 256-MAPBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A002A1 FRE | 8542.31.0001 | 90 | 69 | Coldfire V2 | 32-Bit Single-Core | 166MHz | EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB | DMA, WDT | - | ROMless | - | 64K x 8 | 1.4V ~ 1.6V | - | External | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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DSPB56364AF100 | - | ![]() |
5292 | 0.00000000 | NXP USA Inc. | DSP56K/Symphony | Tray | Obsolete | 0°C ~ 70°C (TA) | Surface Mount | 100-LQFP | Audio Processor | DSPB56 | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 900 | Host Interface, I²C, SAI, SPI | 3.30V | 100MHz | ROM (24kB) | 11.25kB | 3.30V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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S912XET256J2VAL | 14.4749 | ![]() |
6985 | 0.00000000 | NXP USA Inc. | HCS12X | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 112-LQFP | S912 | 112-LQFP (20x20) | - | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 300 | 91 | HCS12X | 16-Bit | 50MHz | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 4K x 8 | 16K x 8 | 1.72V ~ 5.5V | A/D 16x12b | External | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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PTN36241GHXZ | 0.8250 | ![]() |
9606 | 0.00000000 | NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | USB 3.0 | Surface Mount | 12-XFQFN | Buffer, ReDriver | PTN36241 | 105mA | 2 | - | - | 1.7V ~ 1.9V | 12-X2QFN (1.25x2.10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 6,000 | 5Gbps | 500ps | Input Equalization, Output De-Emphasis | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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LD6938CX6/33285PLJ | - | ![]() |
3660 | 0.00000000 | NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 85°C | Surface Mount | 6-XFBGA, WLCSP | LD693 | 5.5V | Fixed | 6-WLCSP (1.2x0.80) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 934067729118 | EAR99 | 8542.39.0001 | 4,500 | 75 µA | Enable | Positive | 300mA, 300mA | 2.85V, 3.3V | - | 2 | 0.4V @ 300mA, 0.4V @ 300mA | 80dB (1kHz) | Over Current, Over Temperature, Soft Start | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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74AUP2GU04GM,132 | 0.0800 | ![]() |
5 | 0.00000000 | NXP USA Inc. | 74AUP | Bulk | Active | -40°C ~ 125°C | Surface Mount | 6-XFDFN | - | 74AUP2GU04 | 2 | 0.8V ~ 3.6V | 6-XSON, SOT886 (1.45x1) | download | ROHS3 Compliant | REACH Unaffected | EAR99 | 8542.39.0001 | 5,000 | Inverter | 4mA, 4mA | 500 nA | 2 | 4.3ns @ 3.3V, 30pF | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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74HC3G14GD,125-NXP | - | ![]() |
1488 | 0.00000000 | NXP USA Inc. | 74HC | Bulk | Active | -40°C ~ 125°C | Surface Mount | 8-XFDFN | Schmitt Trigger | 74HC3G14 | 3 | 2V ~ 6V | 8-XSON (2x3) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3,000 | Inverter | 5.2mA, 5.2mA | 1 µA | 3 | 21ns @ 6V, 50pF | 0.3V ~ 1.2V | 1.5V ~ 4.2V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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74AUP1G00GX,125 | 0.0700 | ![]() |
169 | 0.00000000 | NXP USA Inc. | 74AUP | Bulk | Active | -40°C ~ 125°C | Surface Mount | 4-XFDFN Exposed Pad | - | 74AUP1G00 | 1 | 0.8V ~ 3.6V | 5-X2SON (0.80x0.80) | download | EAR99 | 8542.39.0001 | 4,459 | NAND Gate | 4mA, 4mA | 500 nA | 2 | 6.5ns @ 3.3V, 30pF | 0.7V ~ 0.9V | 1.6V ~ 2V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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N74F125D,623 | - | ![]() |
7519 | 0.00000000 | NXP USA Inc. | 74F | Tape & Reel (TR) | Obsolete | 0°C ~ 70°C (TA) | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 74F125 | - | 3-State | 4.5V ~ 5.5V | 14-SO | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 2,500 | Buffer, Non-Inverting | 4 | 1 | 15mA, 64mA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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74ABT823D,602 | - | ![]() |
3691 | 0.00000000 | NXP USA Inc. | 74ABT | Tube | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | D-Type | 74ABT823 | Tri-State, Non-Inverted | 4.5V ~ 5.5V | 24-SO | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 30 | 1 | 9 | 32mA, 64mA | Master Reset | 200 MHz | Positive Edge | 6.1ns @ 5V, 50pF | 250 µA | 4 pF | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
S9S12GN48AMLF | 3.4623 | ![]() |
3420 | 0.00000000 | NXP USA Inc. | HCS12 | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP | S9S12 | 48-LQFP (7x7) | - | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,250 | 40 | 12V1 | 16-Bit | 25MHz | IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 48KB (48K x 8) | FLASH | 1.5K x 8 | 4K x 8 | 3.13V ~ 5.5V | A/D 12x10b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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TJA1021TK/10/C,118 | 1.5600 | ![]() |
4 | 0.00000000 | NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | - | Surface Mount | 8-VDFN Exposed Pad | Transceiver | TJA1021 | 5.5V ~ 27V | 8-HVSON (3x3) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 6,000 | LINbus | 1/1 | Full | 175 mV | - |
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