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Integrated Circuits (ICs)(31124)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Mounting Type | Package / Case | Type | Features | Base Product Number | Input Type | Current - Supply | Battery Chemistry | Charge Current - Max | Number of Cells | Number of Channels | Output Type | SIC Programmable | Number of Circuits | Ratio - Input:Output | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Logic Type | Number of Elements | Number of Bits per Element | Current - Output High, Low | Function | Current - Quiescent (Max) | Sampling Rate (Per Second) | Number of Inputs | Data Interface | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Max Output Power x Channels @ Load | Interface | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Interrupt Output | Current - Output Source/Sink | Clock Frequency | Resolution (Bits) | Number of Outputs | Voltage Supply Source | Trigger Type | Max Propagation Delay @ V, Max CL | Current - Quiescent (Iq) | Input Capacitance | Input Logic Level - Low | Input Logic Level - High | Fault Protection | Current - Charging | Programmable Features | Battery Pack Voltage | Voltage - Supply (Max) | Output Configuration | Rds On (Typ) | Voltage - Load | Switch Type | Current - Output (Max) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
PMDPB95XNE2115 | 0.0900 |  |
455 | 0.00000000 | NXP USA Inc. | * | Bulk | Active | Not Verified | download | EAR99 | 8541.29.0095 | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
LPC1112FHN24/202J | 1.8700 | |
2714 | 0.00000000 | NXP USA Inc. | LPC1100L | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 24-VFQFN Exposed Pad | LPC1112 | 24-HVQFN (4x4) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 935298399118 | 3A991A2 | 8542.31.0001 | 6,000 | 19 | ARM® Cortex®-M0 | 32-Bit Single-Core | 50MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, POR, WDT | 16KB (16K x 8) | FLASH | - | 2K x 8 | 1.8V ~ 3.6V | A/D 6x10b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S9S12G48F0WLF | 4.3381 | |
8733 | 0.00000000 | NXP USA Inc. | HCS12 | Tray | Active | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP | S9S12 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315326557 | 3A991A2 | 8542.31.0001 | 1,250 | 40 | 12V1 | 16-Bit | 25MHz | CANbus, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 48KB (48K x 8) | FLASH | 1.5K x 8 | 4K x 8 | 3.13V ~ 5.5V | A/D 12x10b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
TDF8599BTH/N1,518 | - | |
7350 | 0.00000000 | NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 36-BSSOP (0.433", 11.00mm Width) Exposed Pad | Class D | Depop, Differential Inputs, I²C, Mute, Short-Circuit and Thermal Protection | TDF859 | 1-Channel (Mono) or 2-Channel (Stereo) | 8V ~ 24V | 36-HSOP | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.33.0001 | 500 | 150W x 1 @ 2Ohm; 70W x 2 @ 4Ohm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MCZ33993EWR2 | - | |
7576 | 0.00000000 | NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | - | Surface Mount | 32-BSSOP (0.295", 7.50mm Width) | MCZ33 | 5.5V ~ 26V | 32-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 1,000 | SPI | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
TDA9955HL/17/C1557 | 4.7300 | |
5 | 0.00000000 | NXP USA Inc. | * | Bulk | Active | download | Not applicable | 3 (168 Hours) | Vendor Undefined | EAR99 | 8542.39.0001 | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
74ALVC02PW,118 | - | |
5558 | 0.00000000 | NXP USA Inc. | * | Bulk | Active | 74ALVC02 | download | ROHS3 Compliant | REACH Unaffected | EAR99 | 8542.39.0001 | 2,500 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S912XEG128BCAA | 11.9387 | |
2901 | 0.00000000 | NXP USA Inc. | HCS12X | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 80-QFP | S912 | 80-QFP (14x14) | - | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320391556 | 3A991A2 | 8542.31.0001 | 84 | 59 | HCS12X | 16-Bit | 50MHz | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 2K x 8 | 12K x 8 | 1.72V ~ 5.5V | A/D 8x12b | External | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
PCA9559PW,118 | 2.0800 | |
1 | 0.00000000 | NXP USA Inc. | - | Tape & Reel (TR) | Active | PC's, PDA's | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | PCA9559 | 3V ~ 3.6V | 20-TSSOP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 2,500 | I²C | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
FS32K118LAT0MLFT | 10.1400 | |
7630 | 0.00000000 | NXP USA Inc. | S32K | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP | FS32K118 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 250 | 43 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | CANbus, FlexIO, I²C, LINbus, SPI, UART/USART | DMA, PWM, WDT | 256KB (256K x 8) | FLASH | 2K x 8 | 25K x 8 | 2.7V ~ 5.5V | A/D 16x12b SAR; D/A1x8b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
PCAL6524HEAZ | 2.1300 | |
8590 | 0.00000000 | NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 85°C | Surface Mount | 32-UFQFN Exposed Pad | POR | PCAL6524 | Open Drain, Push-Pull | 1.65V ~ 5.5V | 32-HUQFN (5x5) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 500 | 24 | I²C | Yes | - | 1 MHz | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MPC860DPVR66D4 | - | |
3313 | 0.00000000 | NXP USA Inc. | MPC8xx | Tray | Obsolete | 0°C ~ 95°C (TA) | Surface Mount | 357-BBGA | MPC86 | 357-PBGA (25x25) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935325303557 | 5A991B4B | 8542.31.0001 | 44 | MPC8xx | 66MHz | 1 Core, 32-Bit | Communications; CPM | DRAM | No | - | 10Mbps (2), 10/100Mbps (1) | - | - | 3.3V | - | HDLC/SDLC, I²C, IrDA, PCMCIA, SPI, TDM, UART/USART | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MC68HC908JB16JDW | - | |
2596 | 0.00000000 | NXP USA Inc. | HC08 | Tube | Obsolete | 0°C ~ 70°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | MC68HC908 | 20-SOIC | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.31.0001 | 38 | 13 | HC08 | 8-Bit | 6MHz | SCI, USB | LED, LVD, POR, PWM | 16KB (16K x 8) | FLASH | - | 384 x 8 | 4V ~ 5.5V | - | Internal | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MC35FS6513NAE | 8.5880 | |
1250 | 0.00000000 | NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS6513 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360438557 | EAR99 | 8542.39.0001 | 250 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
74HC112N,652 | - | |
5726 | 0.00000000 | NXP USA Inc. | 74HC | Tube | Obsolete | -40°C ~ 125°C (TA) | Through Hole | 16-DIP (0.300", 7.62mm) | JK Type | 74HC112 | Complementary | 2V ~ 6V | 16-DIP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 25 | 2 | 1 | 5.2mA, 5.2mA | Set(Preset) and Reset | 71 MHz | Negative Edge | 30ns @ 6V, 50pF | 4 µA | 3.5 pF | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MC9S08SH32MTG | 4.4997 | |
6980 | 0.00000000 | NXP USA Inc. | S08 | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | MC9S08 | 16-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 96 | 13 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 1K x 8 | 2.7V ~ 5.5V | A/D 8x10b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MK21FN1M0VMD12 | 14.8352 | |
8812 | 0.00000000 | NXP USA Inc. | Kinetis K20 | Tray | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 144-LBGA | MK21FN1M0 | 144-MAPBGA (13x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A002A1 | 8542.31.0001 | 160 | 100 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 42x16b; D/A 2x12b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MC8610VT800GB | - | |
2323 | 0.00000000 | NXP USA Inc. | MPC86xx | Box | Obsolete | 0°C ~ 105°C (TA) | Surface Mount | 783-BBGA, FCBGA | MC861 | 783-FCPBGA (29x29) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935321324557 | 3A991A2 | 8542.31.0001 | 36 | PowerPC e600 | 800MHz | 1 Core, 32-Bit | - | DDR, DDR2 | No | DIU, LCD | - | - | - | 1.8V, 2.5V, 3.3V | - | AC97, DUART, HSSI, I²C, I²S, IrDA, PCI, SPI | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MCF5249VF140 | - | |
3791 | 0.00000000 | NXP USA Inc. | MCF524x | Tray | Obsolete | 0°C ~ 70°C (TA) | Surface Mount | 160-BGA | MCF5249 | 160-MAPBGA (15x15) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 126 | 47 | Coldfire V2 | 32-Bit Single-Core | 140MHz | I²C, IDE, Memory Card, SPI, UART/USART | DMA, I²S, POR, Serial Audio, WDT | - | ROMless | - | 96K x 8 | 3V ~ 3.6V | A/D 4x12b | External | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
74LVC1G384GW/S400125 | - | |
8016 | 0.00000000 | NXP USA Inc. | * | Bulk | Active | 74LVC1G384 | download | Not applicable | 3 (168 Hours) | Vendor Undefined | EAR99 | 8542.39.0001 | 3,000 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MC32PF3000A8EP | 5.9223 | |
1061 | 0.00000000 | NXP USA Inc. | - | Tray | Active | -40°C ~ 85°C | i.MX Processors | Surface Mount | 48-VFQFN Exposed Pad | MC32PF3000 | - | 2.8V ~ 5.5V | 48-HVQFN (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320745557 | EAR99 | 8542.39.0001 | 260 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
PCF8591T/2,518 | 4.7700 | |
8471 | 0.00000000 | NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | ADC, DAC | PCF8591 | 4 | 2.5V ~ 6V | 16-SO | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 1,000 | 11.1k | I²C, Serial | 8 b | Single Supply | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
MC908GR16MFAE | - | |
6189 | 0.00000000 | NXP USA Inc. | HC08 | Tray | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP | MC908 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 250 | 37 | HC08 | 8-Bit | 8MHz | LINbus, SCI, SPI | LVD, POR, PWM | 16KB (16K x 8) | FLASH | - | 1K x 8 | 3V ~ 5.5V | A/D 8x10b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MC33882VWR2 | - | |
5239 | 0.00000000 | NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 150°C (TJ) | Surface Mount | 30-BSOP (0.433", 11.00mm Width) Exposed Pad | - | MC33882 | - | N-Channel | 1:1 | 30-HSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 750 | 4.5V ~ 5.5V | SPI, Parallel | 6 | Current Limiting (Fixed), Open Load Detect, Over Voltage | Low Side | 400mOhm | 8V ~ 25V | General Purpose | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MC9S12NE64CPVE557 | 167.2100 | |
5980 | 0.00000000 | NXP USA Inc. | * | Bulk | Active | - | Not applicable | 3 (168 Hours) | Vendor Undefined | 2156-MC9S12NE64CPVE557 | EAR99 | 8542.31.0001 | 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
KMPC8323VRADDC | - | |
9492 | 0.00000000 | NXP USA Inc. | MPC83xx | Tray | Obsolete | 0°C ~ 105°C (TA) | Surface Mount | 516-BBGA | KMPC83 | 516-PBGA (27x27) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A001A3 | 8542.31.0001 | 2 | PowerPC e300c2 | 266MHz | 1 Core, 32-Bit | Communications; QUICC Engine | DDR, DDR2 | No | - | 10/100Mbps (3) | - | USB 2.0 (1) | 1.8V, 2.5V, 3.3V | - | DUART, I²C, PCI, SPI, TDM, UART | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MC32BC3770CSR2 | - | |
7152 | 0.00000000 | NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 25-WFBGA, WLCSP | MC32BC3770 | Lithium Ion/Polymer | 2A | 1 | 25-WLCSP (2.27x2.17) | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 2,500 | I²C | - | Constant - Programmable | Current | 4.475V (Max) | 6.2V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
74HC30N,652 | - | |
6545 | 0.00000000 | NXP USA Inc. | 74HC | Tube | Obsolete | -40°C ~ 125°C | Through Hole | 14-DIP (0.300", 7.62mm) | - | 74HC30 | 1 | 2V ~ 6V | 14-DIP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 25 | NAND Gate | 5.2mA, 5.2mA | 2 µA | 8 | 22ns @ 6V, 50pF | 0.5V ~ 1.8V | 1.5V ~ 4.2V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
TDA8551T/N1,118 | - | |
5215 | 0.00000000 | NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | Class AB | Depop, Mute, Short-Circuit and Thermal Protection, Standby, Volume Control | TDA855 | 1-Channel (Mono) | 2.7V ~ 5.5V | 8-SO | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.33.0001 | 2,500 | 1.4W x 1 @ 8Ohm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MIMXRT1061DVJ6B | 10.6479 | |
2955 | 0.00000000 | NXP USA Inc. | RT1060 | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 196-LFBGA | MIMXRT1061 | 196-LFBGA (12x12) | - | ROHS3 Compliant | REACH Unaffected | 189 | 127 | ARM® Cortex®-M7 | 32-Bit Single-Core | 600MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, POR, PWM, WDT | - | External Program Memory | - | 1M x 8 | 3V ~ 3.6V | A/D 20x12b | External, Internal |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
Wishlist (0 Items)