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Integrated Circuits (ICs)(572)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Base Product Number | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Core Processor | Speed | RAM Size | Flash Size | Module/Board Type | Co-Processor | Connector Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
TE0745-02-93E31-AK | 2.0000 |  |
5313 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Active | -40°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | 1686-TE0745-02-93E31-AK | 1 | Zynq™ 7045 SoC XC7Z045-3FFG676E | - | 1GB | 64MB | MPU Core | ARM Cortex-A9 | Board-to-Board (BTB) Socket | ||||||
|
TE0808-04-09EG-1EK | - | |
8697 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0808-04-09EG-1EK | OBSOLETE | 1 | Zynq UltraScale+ XCZU9EG-1FFVC900E | - | 2GB | 128MB | MPU Core | - | B2B | ||||
|
TE0808-04-9GI21-AS | - | |
6073 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Box | Obsolete | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0808 | download | ROHS3 Compliant | Not Applicable | 1686-TE0808-04-9GI21-AS | OBSOLETE | 1 | Zynq UltraScale+ ZU9 | - | 4GB | 128MB | FPGA Core | - | B2B | |||
|
TE0803-02-04CG-1EA | - | |
9145 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | Not Applicable | 1686-TE0803-02-04CG-1EA | OBSOLETE | 1 | Zynq UltraScale+ XCZU4CG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | |||||
|
TE0720-03-S005 | - | |
2196 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at SIC | - | - | download | ROHS3 Compliant | Not Applicable | 1686-TE0720-03-S005 | 1 | - | - | - | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | - | |||||
 |
TE0723-03 | 138.6000 | |
4116 | 0.00000000 | Trenz Electronic GmbH | TE0723 | Box | Active | 0°C ~ 70°C | TE0723 | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | 12MHz | 512MB | 16MB | MCU, FPGA | Zynq-7000 (Z-7010) | B2B | |||
|
TE0729-02-2IRA | - | |
1815 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Discontinued at SIC | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0729-02-2IRA | 1 | ARM Cortex-A9 | - | 512MB | 32MB | MCU, FPGA | Zynq-7000 (Z-7020) | B2B | |||||
|
TE0813-01-3BE11-A | 520.9300 | |
3537 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0813-01-3BE11-A | 1 | Zynq UltraScale+ XCZU3EG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 240 | |||||
|
TE0803-03-2BE11-A | - | |
2188 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0803 | download | ROHS3 Compliant | Not Applicable | 5A002A TRE | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU2EG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | |||
 |
TE0841-01-035-1C | - | |
3830 | 0.00000000 | Trenz Electronic GmbH | TE0841 | Bulk | Obsolete | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | Not Applicable | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Kintex UltraScale KU35 | 4GB | 32MB | FPGA Core | - | Samtec LSHM | |||||
|
TE0741-04-D2C-1-A | 964.9600 | |
6118 | 0.00000000 | Trenz Electronic GmbH | - | Box | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0741-04-D2C-1-A | 1 | Xilinx Kintex-7 FPGA XC7K325T-2FBG676C | - | - | 32MB | FPGA Core | - | Board-to-Board (BTB) Socket | |||||
|
TE0820-05-2AI81MA | 414.0000 | |
7931 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-TE0820-05-2AI81MA | 1 | ||||||||||||||
|
TE0841-02-41I21-L | - | |
7032 | 0.00000000 | Trenz Electronic GmbH | TE0841 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0841 | download | ROHS3 Compliant | Not Applicable | 1686-TE0841-02-41I21-L | 3A991D | 8471.50.0150 | 1 | Kintex UltraScale KU040 | - | 2GB | 64MB | FPGA Core | - | B2B | ||
 |
TE0712-02-72C36-A | - | |
7432 | 0.00000000 | Trenz Electronic GmbH | TE0712 | Bulk | Discontinued at SIC | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0712-02-72C36-A | 3A991D | 8471.50.0150 | 1 | Artix-7 A100T | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | |||
 |
TE0720-03-61Q33MA | - | |
7595 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0720-03-61Q33MA | EAR99 | 8473.30.1180 | 1 | ARM Cortex-A9 | - | 1GB | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | |||
 |
TE0600-02IVF | - | |
3182 | 0.00000000 | Trenz Electronic GmbH | TE0600 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | REACH Unaffected | 1686-1010 | 3A991D | 8471.50.0150 | 1 | Spartan-6 LX-150 | 125MHz | 256MB | 16MB | FPGA Core | - | Samtec LSHM | |||
|
TE0712-02-200-1I39 | - | |
6680 | 0.00000000 | Trenz Electronic GmbH | TE0712 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0712-02-200-1I39 | 3A991D | 8471.50.0150 | 1 | Artix-7 A200T | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | |||
|
TE0807-03-5AI21-A | 1.0000 | |
6420 | 0.00000000 | Trenz Electronic GmbH | - | Box | Active | - | - | TE0807 | download | ROHS3 Compliant | Not Applicable | 1686-TE0807-03-5AI21-A | 1 | - | - | - | - | - | - | - | ||||
|
TE0817-01-7DE21-A | 1.0000 | |
4119 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0817-01-7DE21-A | 1 | Zynq UltraScale+ XCZU7EV-1FBVB900E | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 240 | |||||
|
TE0745-02-30-2I | - | |
2460 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Obsolete | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | 1 (Unlimited) | OBSOLETE | 0000.00.0000 | 1 | ARM® Cortex®-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7030) | B2B | |||||
|
TE0823-01-3PIU1F | - | |
9424 | 0.00000000 | Trenz Electronic GmbH | TE0823 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1686-TE0823-01-3PIU1F | OBSOLETE | 1 | ARM Cortex-A53, ARM® Cortex®-R5 | - | 1GB | 128MB | MCU, FPGA | Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I | USB | ||||||
 |
TE0741-03-160-2IF | - | |
2598 | 0.00000000 | Trenz Electronic GmbH | TE0741 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0741 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Kintex-7 160T | 200MHz | - | 32MB | FPGA Core | - | Samtec LSHM | ||
 |
TE0808-04-15EG-1EE | - | |
6581 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | Not Applicable | 5A002A TRE | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU15EG-1FFVC900E | - | 2GB | 128MB | MPU Core | - | B2B | |||||
|
TE0720-03-61Q43GA | - | |
8263 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0720-03-61Q43GA | 1 | ARM Cortex-A9 | 125MHz | 1GB | 4GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | |||||
|
TE0725LP-01-72C-1 | 177.4500 | |
1362 | 0.00000000 | Trenz Electronic GmbH | TE0725 | Bulk | Active | 0°C ~ 70°C | 2.870" L x 1.380" W (73.00mm x 35.00mm) | TE0725 | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0725LP-01-72C-1 | 1 | Artix-7 A100T | 25MHz | - | 64MB | FPGA Core | - | 50 Pin | ||||
 |
TE0745-02-35-1C | - | |
4894 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Obsolete | 0°C ~ 70°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | Not Applicable | REACH Unaffected | 1686-1068 | 3A991D | 8471.50.0150 | 1 | ARM® Cortex®-A9 | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7035) | Samtec UFPS | ||||
|
TE0803-04-4DE11-A | 649.9500 | |
9559 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0803-04-4DE11-A | 1 | Zynq UltraScale+ XCZU4EV-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | |||||
 |
TE0726-03IM | - | |
4926 | 0.00000000 | Trenz Electronic GmbH | TE0726 | Bulk | Obsolete | 0°C ~ 70°C | 1.180" L x 1.570" W (30.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0726-03IM | OBSOLETE | 1 | ARM Cortex-A9 | - | 512MB | 16MB | MCU, FPGA | Zynq-7000 (Z-7010) | CSI, DSI | ||||
|
TE0808-04-BBE21-A | 1.0000 | |
4526 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0808 | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0808-04-BBE21-A | 1 | Zynq UltraScale+ XCZU15EG-1FFVC900E | - | 4GB | 128MB | MPU Core | - | B2B | ||||
|
TE0720-03-S004 | - | |
4663 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at SIC | - | - | download | ROHS3 Compliant | Not Applicable | 1686-TE0720-03-S004 | 1 | - | - | - | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | - |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
Wishlist (0 Items)